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Gerneral Information | Application note | ABSOLUTE MAXIMUM RATINGS | CHARACTERISTICS CURVES | LED Knowledge | LED part No system | LED application Guide

GENERAL INFORMATION

 

HOW TO USE LED

·FORMING:

Please do not form the LED after soldering .If forming id necessary ,it must be done before soldering .
Any unsuitable stress applied to the epoxy may break bonding wires in LED.
·SOLDERING:

Soldering Bath ---260℃±5 ℃ within 5 seconds: Soldering Iron-Under 30W within 5 seconds.(1.6mm from epoxy body)
Do not apply any force of mechanical stress onto the leads or epoxy body during soldering heat is remained.
If soldering one line of LED on a P.C . board by using a soldering iron ,don t solder both the leads of the LED at same time .
·CLEANING:

Use Alcohol ,Freon TE or Chlorosen to clean LED at normal temperature for less than l minute .
Do not use unspecified chemical liquid because it may cause crack or haze on the epoxy body.
·PREVENTING OVER CURRENT :

In order to operate LED in stable condition , please put protective resistors in series.
Resistor value can be determined by the formula
R= WHERE:
Vs=Source Voltage
VF=Forward Voltage
If=Recommended Current of LED (10-20mA)
·BRIGHTNESS:

For the purpose of obtaining uniform brightness, LED shall be same current.
It is useful for uniform brightness if you use larger source voltage and protective resistor .

APPLICATION NOTES
   
Cleaning
  • Avoid using any unspecified chemical solvent to clean LED . For example, Trichloroethylene, Chlorosen, Acetone, and Diflon S3MC.
  • Any cleaning method can only be taken under normal temperature in one minute or less if it is required.
  • Alcohol is the one recommended for cleaning.
 

Forming

  • Any forming on lead pin must be done before soldering, not during or after soldering.
  • Avoid applying any stress to resin in order to prevent the epoxy fracture and break on bonding wire.
    While forming, please use a tie bar cut or equivalent to hold or bend the pin.
  • 2mm from the base of resin is the minimum distance for the place bending the lead pin.
  • Avoid bending the lead pin at the same point twice or more.
 

Soldering

  • Pin hole pitch on PCB must match lead pin pitch so as not to cause any stress on lead wires.
  • No stress can be applied to lead pins when they are heated, otherwise disconnection may occur.
  • Three minutes are necessary for LED to cool down to normal room temperature.
 

TECHNICAL DATA

ABSOLUTE MAXIMUM RATINGS
(TA=25oC) 		If Pd Vr IPF TOPR TSTG TSOL
  mA mW V mA oC oC oC
H 25 60 5 150 -40 to +80 -40 to +85 Max.260±5℃ for 3 sec Max.
(1.6mm from the base of the epoxy bulb)
E 25 60 5 150
Y 25 60 5 150
G 30 65 5 150
SR
 25 60 5 150
LR 25 50 5 150
UR 25 60 5 150
UE 30 65 5 150
UY 30 65 5 150
UG 30 75 5 150
PG 30 110 5 150
BG 30 110 5 150
B 30 120 5 100
UB 30 120 5 100
UV 30 120 5 100
W 30 120 5 100
W 30 120 5 100

Parameter
Forward Current IF
Power Dissipation Pd
Reverse Voltage VR
Peak Forward Current IPF (Duty 1/10 @1KHZ)
Operation Temperature TOPR
Storage Temperature TSTG
Lead Soldering Temperature TSOL

CHARACTERISTICS CURVES


Wavelength(nm) RELATIVE INTENSITY Vs WAVELENGTH (λP)

1 655nm/Red
2 568nm/Yellow Green
3 585nm/Yellow
4 635nm/Orange
5 700nm/Bright Red 		6 660nm/super Red
8 610nm/Amper
9 GaAIAS 880nm
10 GaAS/GaAS & GaAIAS/GaAS 940nm
A 430nm/Blue, 470nm/Blue


 

 

 

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